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Boxin Microelectronics’ Project Put into Production

05-16-2022

Recently, the semiconductor packaging project of Boxin Microelectronics (Tianjin) Co., Ltd. was put into production. With a total investment of 80 million yuan, the project will further strengthen and enrich the industry chain of semiconductor public packaging services in TEDA, and thus promote the rapid growth of regional next-gen information technology industry.

The company was founded in TEDA in February 2022. Its founders and managers come from large semiconductor enterprises including Yandong semiconductor, ASM, Motorola and NXP, and assemble a packaging and testing R&D team with strong R&D capability. At present, there are two packaging forms in the enterprise, which can produce more than 30 categories of products.


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