Jingfei Semiconductor Establishes Presence in TEDA

Recently, Beijing Jingfei Semiconductor Technology Co., Ltd. established a new subsidiary in TEDA to build a high-end laser lift-off equipment production base in the TEDA Micro-electronics Innovation Industrial Park. The base will primarily manufacture laser lift-off equipment for silicon carbide (SiC) and diamond substrates, with official production scheduled to commence in the first half of 2027. Jingfei Semiconductor fills a gap in silicon carbide substrate processing equipment in TEDA, injecting fresh momentum into the development of the regional integrated circuit industry.

As a leading innovative enterprise in China's silicon carbide laser precision processing equipment sector, Beijing Jingfei Semiconductor Technology Co., Ltd. relies on the scientific research achievements of the Institute of Semiconductors, Chinese Academy of Sciences (CAS). Focusing on the R&D, production, and sales of dual-pulse laser lift-off equipment for silicon carbide crystal ingots, the company has currently established a full-process technological solution covering laser modification, lift-off, and supporting processes.

TEDA's integrated circuit industry covers the full chain from EDA, design, manufacturing to packaging & testing, and equipment, gathering leading enterprises such as NXP, Empyrean, OmniVision, Axera, and Boxin Microelectronics.