TEDA Guides SDSoW Ecosystem Conference

The 2024 SDSoW Ecosystem Conference successfully concluded at the National Convention and Exhibition Center (Tianjin) on June 21. The conference, themed “Confident SDSoW to Write a New Chapter in Chip Technology,” showcased innovative achievements and future developments in Software Defined System on Wafer (SDSoW) technology. Guided by the Chinese Association for Artificial Intelligence (CAAI), the Chinese Association of Automation (CAA), the Tianjin Association for Science and Technology, and the TEDA Administrative Commission, the conference was to promote innovative technological breakthroughs and high-quality development in China’s chip industry. 

4 renowned academicians and over 200 great experts and leaders gathered here to share more than 10 technical presentations and trend analyses, discussing SDSoW solutions for industries such as artificial intelligence, big data, and intelligent connected vehicles. TEDA introduced the industrial characteristics and development advantages of regional integrated circuit.

During the conference, the Expert Committee of the SDSoW Technology and Industry Alliance was established to lead the rapid development of SDSoW technology.

The newly established Tianjin SDSoW Integrated Circuit Industry Development Center will provide professional guidance, technical consulting, and strategic planning services for SDSoW technology.

9 significant SDSoW technological achievements were unveiled. These include the SDSoW Annual Development Report 2024, the General Engineering Technical Specifications for SDSoW Hardware Manufacturing, and the SDSoW Interconnection Interface Standards (Draft), providing guidance and standards for the design and production of SDSoW systems. The other 6 outstanding SDSoW technological achievements demonstrated innovations and practical applications in solving real-world issues in wafer manufacturing, chip design, packaging and testing, and interconnection.