TEDA Enterprise Jingxinwei Completes B Round Financing

Recently, Jingxinwei Electronics Technology (Tianjin) Co., Ltd., a TEDA-based company, completed the B Round Financing exceeding 100 million yuan. This follows the A Round Financing completed in 2023, marking another successful fundraising effort for Jingxinwei. This round of financing will provide support and assurance for the company’s product R&D, team building, and market expansion.

Founded in 2020 in TEDA, Jingxinwei is dedicated to the development, production, and sales of core chips for China’s new infrastructure construction. The company has established a unique growth pattern that integrates new R&D institutions, incubation platforms, innovation alliances, and commercial entities. To date, Jingxinwei has applied for over 100 intellectual property rights and has been granted 69 invention patents. The company has successfully developed several domestically pioneering chips, including the RapidIO switch chip NRS1800, the software-defined interconnect switch chip ST3210, the intrinsic security switch chip ESW5610, and the bridge chip PRB0400. Additionally, more than 10 chips are currently under development.