Boxin Microelectronics Packaging Plant Put into Operation in TEDA

On August 1, Boxin Microelectronics (Tianjin) Co., Ltd. commenced operations in the Microelectronics Innovation Industrial Park of Tianjin Economic-Technological Development Area (TEDA), filling a key gap in the regional semiconductor industrial chain and enhancing the overall competitiveness of the sector.

Boxin Microelectronics focuses on DFN and QFN packaging, with products mainly consisting of power protection chips. After reaching target output, the plant is expected to achieve a monthly packaging output of over 200 million chips. In addition, the company also plans to expand into advanced packaging sample lines using flip chip processes, power SiC and GaN chip packaging, RF modules, and audio amplifier IC modules, gradually evolving from miniaturized to advanced packaging.

TEDA is one of the regions with the most complete industrial chains and the highest concentration in the field of integrated circuits in China. It has gathered nearly 100 integrated circuit enterprises, forming an industrial chain of integrated circuits, basic components, intelligent terminals, industrial Internet/cloud computing, and automotive electronics. Zhang Minjie, Chairman of Boxin Microelectronics, stated that TEDA has a strong industrial foundation, favorable policy environment, and efficient government services, providing strong guarantees for the rapid implementation and efficient development of the project. Looking ahead, the company will continue to increase R&D investment and strive to become a benchmark and leader in the packaging segment.